品牌:
ST Microelectronics (意法半导体)(34)
Microchip (微芯)(33)
Fairchild (飞兆/仙童)(18)
ROHM Semiconductor (罗姆半导体)(9)
Renesas Electronics (瑞萨电子)(31)
Intersil (英特矽尔)(1)
Xilinx (赛灵思)(1)
Adesto Technologies(2)
NXP (恩智浦)(3)
TI (德州仪器)(2)
National Semiconductor (美国国家半导体)(1)
Microswitch(2)
ATMEL (爱特美尔)(2)
Swissbit(25)
Samsung (三星)(12)
Micron (镁光)(208)
Epson Electronics (爱普生)(1)
LG (乐金电子)(1)
Mitsubishi (三菱)(1)
Lapis Semiconductor(3)
Integrated Device Technology (艾迪悌)(3)
Cypress Semiconductor (赛普拉斯)(29)
Alliance Memory (联盟记忆)(2)
Toshiba (东芝)(3)
NEC (日本电气)(3)
SanDisk (闪迪)(28)
GSI(6)
BSI(1)
Elpida (尔必达)(2)
Advantech (研华)(1)
Microsemi (美高森美)(1)
Virtium Technology(3)
SK Hynix (海力士)(1)
Harris(1)
Integrated Silicon Solution(ISSI)(2)
Kingston (金士顿)(7)
HITACHI (日立)(2)
Wintec(2)
Winbond Electronics (华邦电子股份)(2)
AMD (超微半导体)(1)
Etron Technology(2)
ATP Electronics (华腾国际)(2)
Fujitsu (富士通)(1)
E2V(1)
M-Systems(3)
Micross(1)
多选
封装:
LBGA(3)
VLGA(3)
SOIC-28(1)
PDIP(4)
(184)
TSSOP(5)
Wafer(4)
DIP(6)
SOIC(12)
QCCJ(2)
SSOP(2)
PLCC(2)
SOIC-20(1)
SOIC-8(6)
TSSOP-8(8)
8(7)
WDIP(2)
PDIP-8(1)
Through Hole(4)
DIP-8(4)
SOP(11)
SO N(1)
PLCC-20(1)
DIE(1)
Surface Mount(7)
MSOP-8(2)
-(4)
模具(1)
M2 P, Smart Card Module (ISO)(1)
TSOP(50)
SOJ(10)
TSOP-2(6)
RDIMM-240(3)
FBGA-78(2)
FBGA(31)
BGA(11)
54(3)
FBGA-168(1)
60(4)
TBGA(1)
TQFP-100(2)
UDIMM-288(3)
TQFP(9)
86(3)
TFBGA(4)
LQFP(1)
144(3)
Not Required(1)
QFP(1)
48(1)
CDIP(2)
TSOP1-R(1)
TSOP1(1)
QCCN(1)
VFBGA(4)
SOP-32(3)
TSOP-32(2)
240(1)
MODULE(1)
28(2)
VFBGA-134(1)
44(1)
RDIMM-288(5)
66(1)
90(2)
NVDIMM-288(1)
200(2)
SODIMM-260(3)
DIMM(2)
TSSOP-66(6)
VFBGA-90(2)
84(1)
FBGA-63(1)
FBGA-96(1)
78(1)
TFBGA-96(1)
RDIMM-184(1)
11(1)
32(1)
TSOP-54(5)
VFBGA-54(1)
BGA-90(1)
FBGA-60(1)
多选
包装:
(500)
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